Fujibo Holdings plans to invest about ¥5.3 billion to expand production of semiconductor polishing materials at its Oita plant in Oita City. The company will construct a new processing and office building within the plant’s approximately eight-hectare site. Construction is scheduled to begin in April 2027 and finish in September 2028, with operations expected to start in April 2029. The expansion will increase output of polishing pads used in chemical mechanical polishing for semiconductor wafers, a segment where the company holds an estimated 80% global market share. Demand for the product has grown steadily amid expanding investment in artificial intelligence-related semiconductor production. Fujibo expects sales at the Oita facility to reach about 3.3 times their fiscal 2025 level by 2030. The plant will also serve as a backup production site under the company’s business continuity planning. Source: Yomiuri Shimbun / Nikkei
Photo: Oita Industrial Location Guidance
Stay informed with the latest Fukuoka & Kyushu news and events in English. Sign up for our free weekly newsletter today and never miss a beat. Opt out anytime, your privacy is our priority. Get the inside scoop with The Now
Summaries based on public content, errors may occur during translation. Images credited independently. Send feedback using this form.